DIGI ConnectCore 8M Nano Development Kit

Quick Overview

specification:
APPLICATION PROCESSOR NXP i.MX8 Nano

4x Cortex-A53 cores @ 1.4 GHz
1x Cortex-M7 core @ 750 MHz core for real-time processing

MEMORY Up to 8 GB eMMC, up to 1 GB of LPDDR4 (16-bit)
PMIC Rohm BD71850MWV
GRAPHICS Graphic Processing Unit:

GC7000UL with OpenCL and Vulkan support
2 shader
123 million triangles / sec
0.8 giga pixel / sec
12.8 GFLOPs 32-bit / 12.8 GFLOPs 16-bit
Supports OpenGL ES 1.1, 2.0, 3.0, OpenCL
Shader clock frequency of 500 MHz

LCDIF display controller, supporting up to 1080p 60fps display through MIPI DSI; 4-lane MIPI DSI interface
SECURITY Digi TrustFence®, TRNG, TrustZone, Secure RTC, Secure JTAG, Secure Element
PERIPHERALS/ INTERFACES 1x USB 2.0 OTG controllers with integrated PHY interfaces
3x Ultra Secure Digital Host Controller (uSDHC) interfaces
1x Gigabit Ethernet controller
4x Universal Asynchronous Receiver / Transmitter (UART) modules
4x I2C modules
3x SPI modules
ETHERNET 1x 10/100/1000M Ethernet + AVB
WI-FI 1×1 802.11a/b/g/n/ac dual-band wireless
BLUETOOTH Bluetooth® 5
ON-MODULE MICROCONTROLLER ASSIST Digi Microcontroller Assist™

Independent Cortex-M0+ microcontroller subsystem
Supporting ultra-low power modes @ <3µA OPERATING TEMPERATURE Industrial: -40° C to 85° C (-40° F to 185° F); depending on use case and enclosure/system design STORAGE TEMPERATURE -50° C to 125° C (-58° F to 257° F) RELATIVE HUMIDITY 5% to 90% (non-condensing) RADIO APPROVALS US, Canada, EU, Japan, Australia/New Zealand EMISSIONS/ IMMUNITY/ SAFETY FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548; FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3 DESIGN VERIFICATION Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78 Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT MECHANICAL DIMENSIONS 118 castellated vias, LGA-474, 1.27 mm pitch, fully shielded for radio emissions and thermal management (heat-spreading) 40 mm x 45 mm x 3.5 mm (1.6 in x 1.8 in x 0.1 in) PRODUCT WARRANTY 3-year Description: DIGI ConnectCore® 8M Nano Development Kit DIGI CC-WMX8MN-KIT ConnectCore® 8M Nano Development Kit is a cohesive and cost-effective System-on-Module (SOM) platform built on the NXP® i.MX 8M Nano applications processor. It integrates memory, Digi Microcontroller Assist™ power management, pre-certified wireless connectivity, and advanced Digi TrustFence® device security with a complete open-source Linux software platform based on the Yocto Project™. The SOM platform simplifies embedded product development by eliminating the complexity and risk of custom board designs. The Digi ConnectCore 8M Nano development kit provides multiple display interfaces, camera, audio, Digi XBee® modules, and other hardware options for optimal flexibility and user experience. Digi ConnectCore 8M Nano strikes an optimal balance of performance, power, and cost. It’s suitable for a wide range of industrial, medical, transportation, and agricultural products. It features scalable, power-efficient ARM® Cortex®-A53 and Cortex-M7 processors, rich multimedia, and advanced connectivity. Digi ConnectCore 8M Nano is ideal for Internet of Things (IoT) applications such as Human Machine Interface (HMI), equipment monitoring, audio/voice, edge compute, and machine learning. The development board includes two Digi XBee connectors to enable cellular, short, and long-range connectivity.